PCB Circuit Board Encapsulation Protection

As the core component of electric tools, PCB circuit boards are prone to failures caused by moisture ingress, corrosion, short circuits, and vibration-induced loosening, which can compromise product reliability and safety. The KYMBPA low-pressure molding process delivers an integrated sealing solution for device PCBs, ensuring reliable waterproof, moisture-proof, and dustproof protection.

OurKey Advantages

Low-pressure molding (0.1–0.7 MPa) prevents high-pressure damage to stress-sensitive capacitors, chips, and miniature components on the PCB.
Low-temperature injection molding (≤200°C) effectively protects heat-sensitive components from thermal damage, preserving their electrical performance stability.
Outstanding adhesion and mechanical properties withstand everyday vibrations and impacts, maintaining the integrity of the encapsulation structure and preventing solder joint cracking or component loosening.
The rapid curing process significantly shortens the production cycle, boosts throughput efficiency, and meets the customized production requirements of small household appliances involving multiple varieties and batch production.