PIN Foot & Solder Joint Protection

In response to the protective needs of PIN feet and solder joints under complex operating conditions such as high temperature, high humidity, mechanical bending, and thermal stress, traditional encapsulating materials like epoxy resins and silicones suffer from drawbacks including slow curing, yellowing, and insufficient stress buffering. UV products, with their rapid curing, superior flexibility, and strong weather resistance, can provide customized protection solutions for PIN feet and solder joints, significantly improving the reliability and service life of electronic components.

OurKey Advantages

After curing, it exhibits excellent flexibility, effectively absorbing mechanical stress caused by PIN foot bending and equipment vibration, thereby preventing solder joint failures such as cracks or splits due to stress concentration.
It demonstrates outstanding weather resistance and can endure extreme temperature cycles ranging from -40°C to 80°C.
Under 365nm wavelength UV light irradiation, it achieves rapid positioning cure within seconds, greatly enhancing production efficiency and making it suitable for automated production line operations.