Building a new energy system characterized by clean, low-carbon, safe, and efficient features is a major strategic deployment at the national level. In this systematic project, advancements in every link—from power generation and transmission to energy storage—deeply rely on innovation and support from materials technology. As a critical physical foundation, new materials are driving the energy structure toward a green and intelligent transformation.
Why Choose KYLOTE™
In blasting operations for wind, hydro and photovoltaic infrastructure, electronic detonator control systems encapsulated with low-pressure molding products enable precise initiation under extreme conditions. Core boards in photovoltaic inverters use low-pressure molding and adhesive potting to achieve ultra-thin IP67 sealing, resisting dust, heat and humidity while safeguarding efficient clean-energy conversion.
To meet the stringent safety requirements of electronic detonators under high temperature, humidity and severe impact, low-pressure, low-temperature molding provides integrated precision encapsulation for electronic digital chips. The process delivers excellent waterproofing, vibration cushioning and dielectric strength, improving initiation reliability and intrinsic safety throughout the product lifecycle.
Electronic Detonator Solutions
Power transmission and distribution controls rely on highly thermally conductive adhesives to maintain chip cooling and circuit stability. Grid inspection robots combine bonding and molding to improve joint flexibility and electromagnetic protection, while instrument transformers and smart meters use low-pressure molding for ultra-thin insulation that safeguards accurate transmission of massive power data.
For new-energy batteries, structural adhesives buffer cell expansion stress in traction and residential storage batteries, while thermally conductive adhesives improve liquid-cooling performance. Consumer batteries use low-pressure molding to encapsulate PCB assemblies precisely, preventing electrolyte leakage and protecting component safety.
The global new energy industry has entered deep waters marked by intensive technological iteration: a trillion-dollar market is expanding rapidly, and the revolutions in electrification and energy storage are accelerating. Yet, concerns over battery safety, the pressing need for lightweighting, and the reliability required under extreme operating conditions form an impossible triangle that constrains development. At this pivotal juncture of change, KY New Materials is committed to becoming its customers’ most trusted innovation partner, jointly laying the material foundation for the future of new energy.
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Facing the extreme demands of integrated circuits for precise protection and efficient heat dissipation, low-pressure molding achieves ultra-low-stress encapsulation and vibration-resistant insulation for chip modules, while specialized adhesives handle underfill, thermal interface management, and electromagnetic shielding, collaboratively building a microscopic physical defense line from bare chips to complete systems. This helps customers break through the dual bottlenecks of thermal challenges and reliability in the ongoing trend of high-density integration, unlocking the full performance potential of every chip.
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As new energy grows rapidly and the energy revolution accelerates We keep advancing materials that support the energy transition
In the fields of computing centers and high-speed interconnection, precision sealing ensures zero signal loss for chips/cables, while strong adhesion guarantees equipment vibration resistance and thermal management performance (adhesives), supporting efficient transmission of massive data in 5G/AI/cloud computing and driving the sustainable operation of the digital world.
Why Choose KYLOTE™
Facing the extreme demands of integrated circuits for precise protection and efficient heat dissipation, low-pressure molding achieves ultra-low-stress encapsulation and vibration-resistant insulation for chip modules, while specialized adhesives handle underfill, thermal interface management, and electromagnetic shielding, collaboratively building a microscopic physical defense line from bare chips to complete systems. This helps customers break through the dual bottlenecks of thermal challenges and reliability in the ongoing trend of high-density integration, unlocking the full performance potential of every chip.
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In the era of 5G/6G, AI computing, and intelligent driving, stable and reliable high-speed data transmission is the lifeblood. With cutting-edge low-pressure injection molding encapsulation and high-performance adhesive solutions, we provide insulation sealing, thermal shielding, and stress buffering for core chips, high-speed cables, and precision components, safeguarding signal integrity and structural stability across the entire supply chain. We help customers break physical boundaries and support every connection and computation in the intelligent world with ultimate reliability.
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Facing the high-dynamic motion challenges of humanoid robots and dexterous hands, low-pressure injection molding encapsulates sensors and wiring harnesses, while adhesive solutions deliver thermal conductive potting and structural reinforcement for joints. Comprehensive protection spans every link from perception to actuation, helping customers overcome reliability bottlenecks under miniaturized integration and frequent impacts, enabling embodied intelligence to operate flexibly and reliably in real-world environments.
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In the era of widespread AI adoption and the Internet of Everything, devices such as smartphones, computers, and smart speakers are becoming powerful edge computing nodes, placing extreme demands on the miniaturization, high reliability, and thermal management of internal components. Through ultra-precise low-pressure injection molding encapsulation and specialized adhesive technologies, we provide insulation, heat dissipation, and robust bonding between heterogeneous materials for chips, sensors, and micro-connectors, helping terminal manufacturers break through size constraints and ensuring reliable edge computing performance in compact spaces.
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Under the trend of high-speed and unmanned intelligent manufacturing, industrial sensing and drive modules face harsh operating conditions such as vibration and oil contamination. Our MBPA low-pressure injection molding encapsulation and adhesive solutions work together to safeguard every link from perception to execution, reducing downtime risks for customers, extending equipment lifespan, and ensuring continuous production line operation with ultimate reliability.
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We harness advanced materials and processes to build a highly reliable, high-performance foundation for next-generation supercomputing, AI, and green, low-carbon data centers
Under the wave of electrification and intelligence, transportation is undergoing unprecedented transformation: new energy vehicle three-electric systems face dual challenges of safety and energy efficiency, autonomous driving sensors urgently require precise micro-environment protection, and lightweight car bodies demand reliable multi-material bonding
Why Choose KYROVIA™
Facing the extreme demands of integrated circuits for precise protection and efficient heat dissipation, low-pressure molding achieves ultra-low-stress encapsulation and vibration-resistant insulation for chip modules, while specialized adhesives handle underfill, thermal interface management, and electromagnetic shielding, collaboratively building a microscopic physical defense line from bare chips to complete systems. This helps customers break through the dual bottlenecks of thermal challenges and reliability in the ongoing trend of high-density integration, unlocking the full performance potential of every chip.
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In the transformative era where electrification, intelligence, and lightweighting are reshaping the automotive industry, the three-electric system, intelligent sensing, and electronic architectures are facing extreme challenges such as high and low temperatures, continuous vibration, and high voltage and humidity. Low-pressure injection encapsulation safeguards electronic components and wiring harnesses, while adhesive solutions provide thermal conductive potting, structural bonding, and sealing, collaboratively building system-level protection from the three-electric system to the cabin, helping customers create safer, lighter, and more durable vehicle quality.
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As space exploration advances toward higher altitudes, longer durations, and greater distances, aircraft electronic systems and structural components are facing extreme temperature fluctuations, severe vibrations, and cosmic radiation. Low-pressure injection molding encapsulation safeguards avionics modules and sensors, while high-temperature-resistant adhesives and lightweight sealing solutions secure airframe structures and components, collaboratively building an extreme protection system from core subsystems to the entire airframe. This enables customers to achieve both ultimate reliability and ultra-lightweight designs, ensuring mission success with unwavering confidence.
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Addressing the high-frequency vibration and long-term operational challenges of high-speed railways and urban rail systems, KY New Materials provides low-pressure injection molding encapsulation to safeguard onboard electronics and signal connections, while adhesive solutions ensure thermal management, vehicle sealing, and structural reinforcement. Our comprehensive system-level protection helps customers push the boundaries of reliability and service life, ensuring inherent safety and punctual, smooth operation for every train journey.
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Shipping vessels are continuously evolving toward larger sizes and greater intelligence. Onboard electronics, deck equipment, and underwater systems are constantly subjected to extreme conditions, including salt spray erosion, alternating humidity and heat, and violent wave impacts. Low-pressure molding encapsulation protects electronic components and wiring harnesses, while anti-corrosion bonding and sealing solutions ensure structural integrity and watertightness. Comprehensive all-condition protection helps customers overcome the limits of corrosion and vibration, ensuring reliable performance for every voyage in deep-sea environments.
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Empowering aerospace, rail transit, electric vehicle power systems, autonomous driving, sensors, and lightweight components to safeguard the future of smart mobility
