Proprietary Core Technology
Proprietary MBPA molecular structure design enables a diversified technology portfolio and helps customers set new standards for reliability.
KYLOTE® possesses proprietary core technology featuring a molecular structure design of 'multi-block microphase morphology copolyamide base resin' (MB-CoPolyamide Base Resin); and has independently developed a vertically integrated core technology chain based on MBPA resin, covering the synthesis and modification of functional elastomers, specialty adhesives and coatings, as well as high-performance functional materials.
Proprietary MBPA molecular structure design enables a diversified technology portfolio and helps customers set new standards for reliability.
Breakthrough solutions start with customer needs and deliver customization for diverse requirements.
We pioneered continuous, automated production processes to create cost advantages and help customers reduce costs and improve efficiency.
Our multi-system MBPA materials technology addresses stringent customization requirements across industries, directly empowering advanced downstream manufacturing to significantly improve yield rates and end-product reliability.
Setting new standards for reliability across hard-tech industries, our foundational materials technologies open opportunities in the vast ecosystems of new energy, computing and communications, and intelligent driving.
By employing integrated low-pressure injection molding on connectors, wire harnesses, and connection points, it achieves superior waterproof sealing and stress relief, providing customers with electrical connections that are durable and reliable in harsh environments.
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Non-destructive encapsulation of precision sensors and microswitches is performed to achieve moisture-proof, vibration-resistant, and cushioning protection, helping customers enhance the accuracy, stability, and service life of their core sensing components.
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Encapsulating coils and magnetic cores using low-temperature, low-pressure processes achieves insulation and mechanical reinforcement without compromising the integrity of the enameled wires or the magnetic properties. This eliminates the risk of component cracking for customers and ensures stable inductance performance.
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Performing overall low-pressure injection molding encapsulation for sensitive circuits such as PCBs and ECUs, providing all-round protection against moisture, dust, vibration, and heat, thereby helping customers significantly enhance the reliability of electronic modules under harsh operating conditions.
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Low-pressure injection molding materials are used for the fixation and encapsulation of battery cells, acquisition harnesses, and components, providing structural cushioning and insulation capabilities. This critical process enables customers to develop lighter and safer battery packs.
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Using high-cleanliness, high-precision low-pressure injection molding to protect LED modules, medical devices, and optical components, meeting biocompatibility or optical-grade requirements, and helping customers achieve miniaturization and high-reliability packaging in high-end applications.
Learn MoreBased on multi-block polyamide, MBPA combines strength and flexibility and is a thermoplastic material. It is bio-based, environmentally friendly, intrinsically flame-retardant, highly chemically stable, and offers outstanding waterproof and dustproof capabilities along with excellent temperature resistance.
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