Lithium Battery Protection Board (BMS) Solution

In response to the protective requirements of lithium battery protection boards (BMS) under complex operating conditions such as high temperature, high humidity, and strong vibration, KYLOTE®MBPA low-pressure injection molding technology is employed to provide customized encapsulation protection for BMS. This addresses issues with traditional potting processes, including insufficient material performance and cumbersome procedures, thereby ensuring reliable operation of BMS in energy storage, new energy vehicles, and other scenarios.

OurKey Advantages

Employing low-pressure injection molding at 0.1–0.7 MPa prevents high-pressure impacts from damaging sensitive components on the BMS, such as precision chips and capacitors. The injection molding temperature is ≤200°C, avoiding thermal damage to electronic components and meeting the encapsulation needs of high-precision BMS circuits.
With a low water absorption rate of ≤0.2% (over 7 days), it significantly reduces the risk of moisture-induced corrosion in BMS circuits under high-temperature and high-humidity conditions.
The low-pressure injection-molded encapsulating material can operate continuously within a temperature range of -40°C to 125°C, perfectly adapting to extreme temperature testing scenarios for BMS high and low-temperature performance.
The low-pressure injection molding material exhibits excellent electrical insulation properties, featuring high insulation resistance and superior dielectric strength. It effectively prevents interference caused by battery leakage or short circuits, ensuring accurate test results for voltage, current, and other electrical parameters, thus reflecting the true electrical performance level of the BMS.
The material cures rapidly, reducing the BMS encapsulation production cycle from 24 hours in traditional processes to just 5–50 seconds, greatly improving production efficiency and enabling customization for multiple varieties and small-batch orders.
Compliant with UL94 V-0 standards, it avoids secondary corrosion damage to the BMS's internal precision circuits and battery cells.
It eliminates the need for complex repair procedures requiring additional disassembly tools and avoids component replacement costs caused by damage during disassembly, resulting in low rework expenses.