Lighting Data Cable Encapsulation Solution

In composite operating conditions where PCBs and electronic control modules are exposed to high temperature, high humidity, salt spray corrosion, and severe vibration impacts, traditional three-proof solutions have shortcomings in edge coverage and long-term protection. The KYLOTE™ MBPA low-pressure injection process offers flexible polyamide stress-free full encapsulation, providing customers with integrated customized protection from pins to the entire board, ensuring lasting isolation from environmental erosion and mechanical damage.

OurKey Advantages

  • Excellent sealing performance and temperature resistance
  • Low-pressure injection internal mold wire harness fixation
  • Can also be used to protect internal MF chips and solder joints
  • Secondary injection molding with TPE (190~220℃)

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