Advanced Molecular Technology
Break through technical barriers, challenge technology monopolies, and help customers reduce costs and improve efficiency.
KYROVIA® is committed to material chemistry technologies required in various aspects of human society, including production, daily life, and scientific advancement. Choosing KYROVIA™ stems from our unwavering belief in independent innovation of cutting-edge materials and our shared pursuit of a safe and reliable smart world.
Ensuring that every smart product is safer and more reliable thanks to KYROVIA®’s materials is not only our mission but also the reason we earn customer trust and become the industry’s preferred choice.
Break through technical barriers, challenge technology monopolies, and help customers reduce costs and improve efficiency.
We independently develop a diverse portfolio of high-end adhesives and master core material formulations—our customers' needs are our needs.
Keeping pace with our customers, we build long-term, mutually beneficial partnerships through joint innovation and seamless product integration.
Spanning core sectors including aerospace, rail transit, and new energy, we break through technical barriers and challenge technology monopolies.
Hot
2K EP Structural Adhesive
KYROVIA 3250
Hot
UV PUR Hot Melt Adhesive
KYROVIA 3950
Hot
2K Acrylic Structural Adhesive
KYROVIA 3431G
Hot
UV Curable Adhesive
KYROVIA 6070
We provide more than high-performance bonding materials. Grounded in specific application scenarios and process requirements, we tailor reliable, efficient adhesive solutions that apply professional bonding expertise to advance manufacturing and product innovation.
High-strength bonding is used to replace traditional processes such as welding and riveting, evenly transferring and dispersing structural stress. This helps customers achieve lightweight and integrated components, significantly enhancing impact resistance and long-term durability.
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A single application of adhesive simultaneously achieves fixation and elastic sealing, effectively compensating for thermal expansion and contraction displacements while resisting moisture and dust. This helps customers streamline assembly processes and ensures long-term, reliable, and superior environmental protection.
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Deep, integrated potting encapsulation is applied to sensitive components such as PCBs and sensors, providing comprehensive moisture resistance, vibration resistance, insulation, and salt spray resistance, ensuring that customers' core electronic units can operate stably even under extreme conditions.
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While efficiently conducting heat, it also provides bonding or sealing performance, rapidly eliminating thermal bottlenecks. Through an ultra-thin coating, it offers three-proof, insulation, and moisture-proof protection for circuit boards and components, serving as a critical solution to enhance system power density and long-term operational reliability.
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