Thermal Conductivity at Chip Interface

In response to the rapid advancement of integrated circuits driven by Moore's Law, chip overheating has become increasingly severe, necessitating superior interface thermal materials to efficiently dissipate heat and maintain core components within an optimal operating environment.

OurKey Advantages

  • Excellent electrical insulation, high thermal conductivity, flame retardancy, and weather resistance;
  • Non-toxic, odorless, non-corrosive, with stable chemical and physical properties;
  • High and low-temperature resistance, suitable for long-term use within the -50~200°C range.

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