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Epoxy Potting Adhesive KYROVIA 8239

  • Weight ratio 100:10
  • Thermal conductivity of 2.0 W/m·K
  • Excellent waterproof, thermal conductive, and insulating performance
  • Suitable for thermal potting applications in consumer electronics and semiconductors
Epoxy Potting Adhesive

Performance Parameters

  
Component A
Color:White
Viscosity:35100 mPa·s
Component B
Color:Colorless
Viscosity:29.6 mPa·s
Mixing
Mixing ratio (weight ratio A:B):100:10
Working time:3.5 hours
Curing time @80℃:2 hours
Post-cure hardness (Shore D):81D

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