Underfill Epoxy Adhesive KYROVIA 8313
- Chip-level underfill
- Low CTE, significantly reduces package stress after curing
- Excellent impact resistance and moisture-heat aging resistance
- Suitable for bottom filling of CSP/BGA and other packages
Performance Parameters
| Product Model: | 8313 |
| Color: | Black |
| Viscosity: | 20000 mPa·s |
| Density: | 1.55 g/cm3 |
| Hardness (Shore D): | 86D |
| Glass Transition Temperature: | 120 ℃ |
| Coefficient of Thermal Expansion Before Tg: | 15 K⁻¹ |
| Coefficient of Thermal Expansion After Tg: | 70 K⁻¹ |
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