Thermal Interface Material KYROVIA 8511
- One-component, reworkable
- Phase transition temperature 45°C, thermal conductivity 3.4 W/m·K
- Excellent thermal performance, can be dispensed, screen printed, or manually coated
- Thermal conduction between heat sinks and heat-generating devices, such as microprocessors, graphics processors, IGBTs, FBDIMMs/memory, etc.
Performance Parameters
| Product Model： | 8511 |
| Pre-Cure Properties | |
| Appearance： | Gray Paste |
| Viscosity (1 rpm)： | 800,000~1,200,000 mPa·s |
| Viscosity (10 rpm)： | 500,000~700,000 mPa·s |
| Density： | 1.8 g/cm³ |
| Post-Cure Properties | |
| Density： | 2 g/cm³ |
| Thermal Conductivity： | 3.4 W/m·K |
| Volume Expansion Rate： | 15% |
| Phase Transition Temperature (DSC)： | 45°C |
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Thermal Interface Material KYROVIA 8520
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