Small Auxiliary Materials, Big Future | KY New Materials Showcases at the 2025 Supernode Interconnection Technology Summit!

Source: KY New Material Views:

In the intelligent era of surging data, high-speed cables serve as the 'neural network' of the digital world, enabling lossless transmission of massive data for AI training, cloud computing, and ultra-large-scale data centers. Along this information superhighway, there exists a long-overlooked yet crucial component—electronic auxiliary materials. These are the 'invisible guardians' ensuring signal integrity and robust connectivity.

KY New Materials, as an innovation leader in the field of high-end electronic auxiliary materials, will be present at the 2025 Supernode Interconnection Technology Innovation Conference and the 14th Connection Technology Seminar on October 31st, joining industry peers to explore the material frontiers of high-speed interconnection's future! (KY booth number:No. 13)

Facing Three Major Challenges, KY Reshapes Performance and Reliability with New Material Science
As transmission rates advance toward 800G, 1.6T, and beyond, high-speed cable assemblies face severe challenges in signal integrity, thermal damage during processing, and mechanical reliability. Leveraging its cross-disciplinary expertise in polymer materials and RF electronics, KY has introduced three innovative solutions:
 
Low-Dielectric Constant UV Solder Joint Protection Adhesive
Precisely adjusts impedance, improving solder joint region impedance by 15–25%;
Supporting PCIe 6.0+ systems to pass stringent certification.
Highly Responsive Low-Temperature Injection-Molded PA Cable Protection Adhesive
Injection molding temperature as low as 175–190°C, eliminating thermal damage;
Protects the structure of high-speed TWINAX cables (especially foamed cables), enhancing yield and consistency.
High-Bond Strength PA Cable Protection Adhesive:
Increases bond strength between cables, PCBs, and solder joints by 30–50%;
Outstanding aging resistance ensures long-term connection reliability.
 
Beyond Products, KY Builds an 'Auxiliary Materials Ecosystem'
 
From Products to Ecosystem: KY’s Solution Matrix
Frontend Processing:Provides specialized primers tailored for use with injection molding adhesives, treating difficult-to-bond materials such as PPA connector housings to further enhance interfacial strength.
Process Support:Has developed a series of conductive silver adhesives and EMI shielding elastomers to address active device grounding and localized electromagnetic shielding issues.
Post-Processing Protection:In addition to cable protection, it also offers conformal coatings and thermally conductive gels, providing comprehensive protection for entire board-level or module-level systems.
 
KY’s Core Advantages: Value Beyond Products Alone
Technology-Driven, Deep R&D:KY possesses a national-level polymer materials laboratory and has established joint laboratories with multiple top-tier universities, ensuring continuous technological leadership.
Direct Sales Model, Agile Response:Abandoning traditional distribution models, KY has built a professional team of Field Application Engineers (FAEs) who directly engage with customers’ R&D and production departments, offering end-to-end technical support from material selection, sample preparation, pilot production to mass manufacturing, with response times measured in hours.
Customized Services, Agile Development:Fully recognizing that 'standard products may not always be the optimal solution,' KY boasts strong custom development capabilities. Based on clients’ specific cable structures, connector types, production rhythms, and equipment parameters, it can deliver customized formulation proposals within 2–4 weeks and rapidly provide samples.
 
On-Site at the Exhibition & Invitation to Exchange
Live Coverage from the Exhibition Floor:
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We welcome you to visit our booth, discuss technical details on-site, and obtain samples and solution documentation.
Technical discussion topics include:
> Controlling Impedance Consistency in High-Speed Cables
> Optimizing Low-Temperature Injection Molding Processes
> Design and Validation of High-Reliability Bonding
 
Together with KY, let us build a future where 'small auxiliary materials make a big difference.'
In the Terabit/s era, the limits of materials define the limits of system performance. KY aspires to be your most trusted materials partner, grounded in technological innovation and committed to customer success, turning every 'impossible' into 'possible.' We look forward to meeting you at the 2025 Supernode Conference and jointly exploring the next frontier of high-speed interconnection!